Life Spine Announces Issuance of 200th Patent

March 31, 2021

March 31, 2021

HUNTLEY, Ill.–(BUSINESS WIRE)–Life Spine, a leading medical device company that designs, develops, manufactures and markets products for the surgical treatment of spinal disorders, announced today that it has received notice of issuance from the U.S. Patent and Trademark Office (USPTO) regarding U.S. Patent No. 10,973,553, which signifies Life Spine’s 200^th patent to date.

“With our 200^th patent granted, Life Spine has one of the highest patent outputs per employee in the industry and this rich IP portfolio is a key driver to our success,” said Michael Butler, Life Spine President and CEO. “Our strong intellectual property position and R&D dedication allows us to serve our customers with the best performing products possible. Our Micro Invasive™ expandable products are gaining consistent adoption as we position ourselves for some of the largest growth in the industry.”

Life Spine’s IP portfolio consists of over 265 patents and applications with a strong position around expandable technology. With over 11 expandable 510(k) clearances and an additional 17 in the queue, Life Spine has the most advanced expandable product offering to date. Migrating procedures into the ASC is one key driver to building out the procedural portfolio, making minimally invasive procedures even smaller, Micro Invasive.

Surgeon interest in the clinical advantages of this enabling technology is high and Life Spine’s product pipeline and clinical research efforts continue to increase to meet the needs of physicians and their patients.

About Life Spine

Life Spine is dedicated to improving the quality of life for spinal patients by increasing procedural efficiency and efficacy through innovative design, uncompromising quality standards, and the most technologically advanced manufacturing platforms. Life Spine, which is privately held, is based in Huntley, Illinois. For more information, please visit: http://www.lifespine.com and/or https://www.micro-invasive.com.